This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating Lower thermal resistance between the package and the PCB.Self-centering during the reflow process which reduces placement problems during surface mount soldering.Intel Mobile Celeron in a BGA2 package (FCBGA-479) the die appears dark blue. Of all the packages, the BGA is the most popular package used in high I/O devices in the industry. Finally, it helps to improve overall board performance at an additional cost.
This greatly reduces the requirement for PCB area and minimizes signal integrity issues on the board. PoP allows multiple ICs to be integrated into a single package such as a logic device or memory to be packaged with a processor. It’s a process of stacking components or ICs together. PoP is an acronym for package on package. Thus, leading to better performance at high speeds. The connections from the die to the balls in BGA ICs are on average shorter than perimeter-only type connections such as DIP ICs. BGA packages can provide more IO connections compared to dual in-line or flat packages. The BGA die connections are routed to the solder balls using metal traces on the substrate. Figure (2) displays how the BGA die is connected to the substrate using flip-chip technology. Figure (1) shows how the BGA die/chip is mounted on the substrate and connected to the substrate by wire bonding technology. Figure 1: Die connected to BGA with wire bond technology Figure 2: Die connected to the BGA using Flip-chip technologyįigure (1) and Figure (2) display two examples of how BGA devices are constructed. These solder balls are affixed to a laminated substrate at the bottom of the package. This SMD package employs an array of metal spheres that are made of solder called the solder balls for connections to the PCB (Printed Circuit Board). In this article, we discuss the following,Ī Ball Grid Array Integrated Circuit is a surface mount device (SMD) component that possesses no leads. This enables the design and manufacture of compact products.īGA devices are used extensively in modern products such as mobiles, PCs, and various communication devices. Such BGA ICs have a smaller form factor and help decrease the size of circuits. BGA ICs having 4 pins to more than 500 IO’s are commonly available. The need for more interfacing input/output (I/O) leads and smaller device sizes have increased and this need can be met with the BGA (Ball Grid Array) package. RLC Resonant Frequency and Impedance CalculatorĮlectronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology.Bandwidth, Rise Time and Critical Length Calculator.Transmission Line Reflection Calculator.Trace Width and Current Capacity Calculator.
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